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Khabre desk
Recent reporting, analysis and explainers from the Semiconductors desk.
technology
Commonwealth Fusion Systems says it and the US Department of Commerce signed a letter of intent for $85 million in proposed federal incentives. The company plans to use the support for semiconductor and electronics projects linked to its fusion machines.
technology
Samsung Electronics has announced a partnership with Mistral AI to develop on-premises AI systems for chip design, defect detection, equipment optimisation and semiconductor manufacturing.
technology
AMD says select Versal RF adaptive SoCs will support native UCIe 1.1 links for co-packaged chiplets, with production chiplets expected alongside select devices in the fourth quarter of 2027.